Медь бескислородная. Испытание на прилипание окалины
Название (англ.):
Oxygen-free copper; Scale adhesion test
Описание (англ.):
Provides a means of assessing the usability in electronic devices, for applications involving glass-to-metal seals, or other uses relying on the formation and presence of an adherent film of copper oxide. The procedure includes preparation and heating in air of a test piece, followed by rapid cooling in water and visual examination for loss of the oxide film or blistering.